The factory has established a total quality management system covering all aspects of sales, R & D, procurement and production, and passed the ISO 9001:2015 certification. The unique iMES interactive manufacturing execution system is created to monitor the product status in real time, so as to deal with the abnormal and improve the management.
Increase production efficiency by more than 25%
Improve prevent the quality problem and shorten the processing time
Indirect labor was reduced by 60%
Effective management of work prevention and omission
Improve sales order-taking ability
Customer's trust is much better than competitors
4lines：Print+SPI+ CM602(high)×2+CM602+ Reflow(air)+AOI
4lines：Print+SPI+ CM602(high)×2+CM602+ Reflow(nitrogen)+AOI
2lines：Print+SPI+ CM402(high)+CM402+Reflow +AOI
SMT workable PCB Max size：510*510mm
SMT workable PCB Min size：50*50mm
Mounting Max processing material size：100*90mm
Mounting Image processing ball pitch：PCIH>0.5mm
PCB Max size610*610mm
1 Line：Insert line + Reflow(nitrogen)+AOI
5 Lines：Insert line +Reflow+AOI
1. Fast and accurate alignment, and chip absorption. It can automatically be placed, burned, and packed.
2. Support IC Packaging: SOP SSOP TSSOP PLCC QFN QFP BGA, etc.
Realize stress-free depanel
1. Maximum PCB size: 520 * 500mm.
2. Side B: High Max less than 10 mm, It should not have over 10mm high component within 15mm from the perimeter of the cutting point.
PCB Max size: 645×520mm.
Chip max size： W80mm*L80mm.
Alignment system: HDMI HD digital imaging system, automatic optical zoom.
PCB Max size： W900mm*L925mm.
Crimp component Max size： W60mm*L290mm.